Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2001
Session ID : 442
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442 Fatigue Strength Evaluation for Intermetallic Compound Layer in Lead-free Solder Joints
Qiang YU, Masaki SHIRATORI, Do-Seop KIM, Yasuhiro TAKAHASHI
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Keywords: Solder Joint, Fatigue Test, Intermetallic Compound Layer, SnAgCu, SnAgBi
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© 2001 The Japan Society of Mechanical Engineers
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