Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2001
Session ID : 443
Conference information
443 Warpage Simulation of Electronic Package in High Temperature
Hidehisa SAKAI, Masaki SHIRATORI, Qiang YU, Masahide KANEKO
Author information
Keywords: Solder Joint, Warpage, BGA, Elastic modulus, FEM
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (349K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2001 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Successor

The Proceedings of the Materials and Mechanics Conference

Share this page
feedback
 Top