738 AFM を用いたシリコン基板とタングステン微小材料の界面はく離試験法

抄録

An experimental method for evaluating the interface strength of micro-component on a substrate is developed using a modified Atomic Force Microscopy (AFM). The diamond tip is dragged along the surface of silicon (Si) substrate with a micro tungsten (W) piece, and the lateral as well as the vertical load and displacement are continuously monitored during the test. After the tip hits the W piece, the lateral load, F_1,increases in almost proportion to the lateral displacement, δ_1,and the piece is abruptly separated from the substrate along the interface.