Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2003
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Lead-free Solder Joints Strength for Wave Soldering after Reflow Soldering
Hiroyuki TAKAHASHI, Kenji HIROHATA, Katsumi HISANO, Takashi KAWAKAMI, Naoyuki OZAWA, Kunihiko SASAHARA
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Keywords: Lead-free Solder, Wave Soldering, Reflow Soldering, Solder Joint, QFP
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 621-622

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© 2003 The Japan Society of Mechanical Engineers
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