Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2003
Conference information
Evaluation of delamination of connections in electronic packages using anisotropic conductive adhesive film during Moisture/Reflow sensitivity test
Won Keun Kim, Toru IKEDA, Noriyuki MIYAZAKI
Author information
Keywords: Anisotropic Conductive Film (ACF), Delamination Test, Stress Intensity Factor, Moisture, Reflow sensitivity test
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 623-624

Details
Download PDF (319K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2003 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Successor

The Proceedings of the Materials and Mechanics Conference

Share this page
feedback
 Top