Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2004
Session ID : 422
Conference information
Study on Evaluation for Fatigue Strength of Copper Wiring in Printed-Wiring Board
Yasuhiro NAKA, Akihiro YAGUCHI, Ryosuke KIMOTO, Takashi MIWA
Author information
Keywords: Life Prediction, Fatigue, Finite Element Method, Electronic Package, PWB, NSMD, Copper, Wiring
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (377K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2004 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Successor

The Proceedings of the Materials and Mechanics Conference

Share this page
feedback
 Top