Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2004
Session ID : 633
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Effect of Specimen Size and Microstructures on Creep Properties for Fine Wire Solder
Kyohei TAKAHASHI, Takeshi OGAWA, Tadashi OHSAWA
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Keywords: Wire solder, Sn-37Pb, Sn-3.5Ag, Effect of specimen size, Effect of Microstructure
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© 2004 The Japan Society of Mechanical Engineers
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