Abstract
Recentry, as for the solder material, the changeover from eutectic Sn-Pb solder to lead-free solder (Sn-Ag-Cu, Sn-Zn) is proceeded from a view of the environmental preservation. However, the low cycle fatigue characteristic of lead-free solder is not sufficiently examined and the mechanism of failure in devices is unclear yet. In this study, using the electronic device part, low cycle fatigue test for lead-free solder was conducted. Combining with FEM analysis, the relationship between inelastic strain range and low cycle fatigue life was evaluated.
