Abstract
With the miniaturization of an electron device, and high integration, a solder joint is made detailed and the heat fatigue reliability poses an important problem. Moreover, in case a design change of a package is made, grasp of the relation between each design parameter and reliability is demanded. So, in this research, the degree analysis of influence to the reliability of each design parameter was performed using the experimental design for the BGA package. Moreover, the correlation of each design parameter was clarified by using the clustering technique to the obtained result.
