Proceedings of the 1992 Annual Meeting of JSME/MMD
Online ISSN : 2433-1287
2005
Session ID : P57
Conference information
P57 Measurement of Thermal Deformation of BGA Packaging Circuit Board using Laser Speckle Interformetry
Takashi Ohkoshi, Azusa Ishimori, Koichi Sekiguchi, Koji Koibuchi
Author information
Keywords: Laser Speckle, FEM, BGA, Thermal Deformation, Creep Damage
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (620K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2005 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Successor

The Proceedings of the Materials and Mechanics Conference

Share this page
feedback
 Top