材料
Online ISSN : 1880-7488
Print ISSN : 0514-5163
ISSN-L : 0514-5163
論文
シリコンの融点と弾性定数を再現するボンドオーダ型原子間ポテンシャルの開発
熊谷 知久原 祥太郎泉 聡志酒井 信介
著者情報
ジャーナル フリー

2006 年 55 巻 1 号 p. 1-7

詳細
抄録
The Tersoff potential is one of the most widely used interatomic potentials for silicon. However, its poor description of the elastic constants and melting point of diamond silicon is well known. In this research, a new bond-order type interatomic potential has been developed that can reproduce the elastic constants and melting point of diamond silicon as well as the cohesive energies and equilibrium bond lengths of polytypes of silicon. We improved the original Tersoff potential function through the introduction of a flexible angular dependent term. In order to increase the robustness of the potential, systems that include a wide range of local atomic environments are employed for fitting. Optimized potential parameters were found using a genetic algorithm. The elastic constants and melting point of diamond silicon calculated using the developed potential turned out to be C11 = 166.4GPa, C12 = 65.3GPa, C44 = 77.1GPa and Tm = 1681K. It was also found that only elastic constants can be reproduced using the original Tersoff potential function, and that our proposed angular dependent term is a key to reproducing the melting point.
著者関連情報
© 2006 日本材料学会
次の記事
feedback
Top