Design of Ceramic Materials with Strong Adhesion to Resin with a Combination of Orthogonal Array and Response-Surface Method

抄録

Appropriate ceramic materials with strong adhesion to a resin, which is used for thin-film devices, were selected by using a combination of an orthogonal array and a response-surface method. In this technique, at the first step, important factors that significantly influence the adhesion strength were selected from various factors that characterize ceramic materials by using an orthogonal array with molecular simulations. As a result, the short-side and long-side lattice constants a and b were selected from four ceramic-material factors (a, b, the surface energy density, S, and the cohesive energy, C). At the second step, the adhesion strength was described as a function of the selected important factors by using a response-surface method. From this function, the ideally most appropriate values for a and b that made the adhesion strength maximum were obtained. The ideal values for a and b were obtained as 0.245nm and 0.424nm, respectively. At the third step, the most appropriate ceramic material whose lattice constants were the closest to the ideal values (a =0.245nm and b=0.424nm) was selected by use of the simulation results of lattice constants. As a result, a SiO₂/Al₂O₃/TiO₂ multilayer whose lattice constants were a =0.243nm and b =0.421nm (the closest to the ideal values) was selected as the most appropriate ceramic material with the strongest adhesion to the resin.