形状記憶合金アクチュエータを用いた超小型材料試験機の開発

抄録

Some electrical appliances, such as mobile phones, have been miniaturized recently to create them in wearable form, because the size of the devices incorporated in those appliances has become remarkably smaller and thinner. For instance, a semiconductor device consisting of a laminated thin-film structure deposited onto a thin substrate by a physical vapor deposition technique is well known. When these laminated devices are designed, the mechanical property of each thin-film material is required. However, current device design is based on bulk material data. To satisfy the technical requirements, testing devices for measuring the mechanical property of a thin-film material have been developed. The devices become large despite a very small-sized specimen to precisely control the testing waveform. In this study, to achieve more-compact testing devices, a shape memory alloy wire was adopted as a new actuator, and all testing functions of an actuator, load amplification, load cell, and displacement sensor were combined in one unit. For checking the motion of the developed device and the PID control system developed based on an Arduino system, tensile and fatigue tests were conducted for SUS304 thin film. It was confirmed that the tensile and fatigue tests were carried out appropriately according to the control pattern.