Residual stresses of a plate of aluminum alloy were measured using a double exposure method (DEM) with synchrotron X-rays of 30 keV. However, the DEM has not be applied in the range of high-energy synchrotron X-rays. In this study, the stress measurements of a shrink-fitted ring using the DEM with synchrotron monochromatic X-rays beyond about 70 keV were performed. A CdTe pixel detector and a CCD camera were used as a detector. The shrinkfitted specimen of SUS304 was quasi-coarse grains of 43 micro-meters, and the diffraction rings were spotty. Despite quasi-coarse grains, it was possible to measure the stresses of the shrink-fitted specimen using the DEM. As a result, the DEM is excellent method to measures the stress for coarse grained materials. In addition, it is better to make the length between the detection positions longer to improve precision of the DEM. On the other hand, it was ineffective to increase the positions of detection.
