抄録
Intermittent stress creep tests were performed of low carbon steel, commercially pure titanium, commercially pure aluminum, high purity aluminum (99.99%), tough pitch copper (99.9%) and high purity copper (99.99%) at various temperatures, in order to get informed of the mechanism of the static-to-dynamic transition in creep. Drastic transitions were observed in the materials of commercial purity, whereas transitions were not apparent in the materials of high purity (99.9% or more). With regard to the effect of temperature, there seems to be a critical temperature for each material above which the transition appears and below which it does not appear. The critical temperature is likely to be related to the strain ageing temperature of the material. There was no difference between the transition behaviors in the range of the high temperature creep and the low temperature creep. According to these results, the transition is possibly related to the interaction of dislocations and solute impurities, appearing at temperatures where the diffusion rate of the solute atoms is high enough to get to dislocations readily. This means also that the interaction of creep and creep recovery, which is the cause of the transition, is related to the solute-dislocation interactions.
