Journal of the Society of Materials Science, Japan
Online ISSN : 1880-7488
Print ISSN : 0514-5163
ISSN-L : 0514-5163
On the Influence of Coupling between Temperature and Strain Field on Maximum Thermal Stress
in the Case of One Dimensional Plate
Toshio FURUKAWAYoitiro TAKEUTIShohachi WAKASUGI
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1985 Volume 34 Issue 386 Pages 1283-1288

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Abstract
The present paper deals with the influence of thermomechanical coupling on the maximum thermal stress in a one-dimensional plate in detail. Investigations were done by varying the factors related to the maximum thermal stress ratio. The factors examined were the coupling parameter, Biot's number and Poisson's ratio. Though close form solutions were obtained for a plate heated on its both surfaces, the numerical analysis was performed for a plate heated on one surface.
The results obtained are summarized as follows:
(1) The rate of increase of the maximum thermal stress ratio for the coupling parameter tends to decrease gradually.
(2) The maximum thermal stress ratio is largest when Biot's number at the unheated surface side is 0 and that at the heated surface side is nearly 4.
(3) The maximum thermal stress ratio increases almost linearly with the decrease of Poisson's ratio.
The above maximum thermal stress ratio is the quantity defined by |(σδmax0max)/σ0max|×100 (%), where σδmax and σ0max are coupled and uncoupled maximum thermal stress, respectively.
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© by The Society of Materials Science, Japan
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