抄録
This paper describes the precision three-points bending machine developed for measuring Young's modulus of thin films used for electronic devices. The developed machine has 0.05μm displacement and 9.8×10-6N load resolution. The Young's modulus of 200μm glass plate in thickness measured by the machine agreed with that of the published value within 3% difference, which shows that the machine has a sufficient performance and reproducibility of the data. The Young's moduli of sputtered Co-Ta-Zr amorphous thin films, of which thickness were ranged from 1μm to 10μm, were measured. The Young's moduli of the thin films thicker than 4.5μm showed a constant value of 150GPa, but those smaller than 4.5μm in thickness increased with decreasing film thickness. The Young's modulus of 1μm in thickness showed a value of 250GPa which is about 70% larger than that of 10μm in thickness. The Young's moduli measured for the films more than 4.5μm in thickness well agreed with the bulk Young's modulus of amorphous Co alloy.
