抄録
Mode of debonding on the interface between Al matrix and SiC whisker aligned unidirectionally is simulated by using the finite element method, and the subsequent creep crack growth in the matrix at 300°C is treated in the framework of the continuum damage mechanics. In order to estimate damage and stress development in the vicinity of the whisker, a unit cell model which is based on a kind of periodical boundary condition is employed. Damage development associated with stress/strain for the unit cell model is calculated as the axisymmetric and also plane strain conditions, and the difference between both results are compared. The analyses of debonding and creep crack growth are carried out by using a local approach, and macroscopic creep deformation of MMC as well as microscopic damage and stress distribution is also evaluated, and the result is discussed in the comparison with the experimental data.
