Journal of the Society of Materials Science, Japan
Online ISSN : 1880-7488
Print ISSN : 0514-5163
ISSN-L : 0514-5163
X-Ray Stress Measurement for ‹110› Oriented TiC Films
Shouichi EJIRIZheng LINToshihiko SASAKIYukio HIROSE
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1997 Volume 46 Issue 7 Pages 750-755

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Abstract

The investigation on the residual stress of titanium carbide films in terms of the X-ray diffraction method is our purpose. However, it is hard to measure the stress by the commonly used X-ray stress measurement, because the sin2ψ method demands macroscopic isotropy from the specimen but the ‹110› orientation is observed for our evaporated TiC film by CVD. Therefore, in this paper, the X-ray stress measurement for ‹110› oriented films was formulated by introducing the weighted average method for the crystallite orientation distribution. The formulation derived showed that the relation between the stress of the specimen and the measured strain by X-ray diffraction depended on the measured diffraction planes. Then, the stress calculation was made and discussed based on the loading experiments.

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