抄録
Recently, nanometric surfacing of microcomposite material has been required for the high performance and precision of electronic parts. In this paper, the grinding of the microcomposite material which consists of the materials of different mechanical property, such as hardness or stiffness is studied to find an available grinding condition. As our main interest is focused into the dependence on the mechanical properties of constructed materials, a molecular dynamics simulation is carried out on 2-dimensional model by using a simple atomic interaction. The dependence of surface roughness on grinding velocity and grinding depth is investigated and the distribution of atomic stress and grinding force are evaluated. The main results are as follows. The irreversible movements of dislocation from the hard material to the soft material across the interface were observed and the dislocations which caused residual stress were trapped in the soft material. The bending of the hard material was observed in grinding process. The grinding force ratio almost did not depend on the mechanical properties of composite but only depended on the geometrical relation between composite and abrasive grain.
