Vinylester resin having hydroxymethyl group (VEDA) was synthesized by the reaction of epoxy resin having hydroxymethyl group with acrylic acid. Effect of hydroxymethyl group on photopolymerization and after thermal curing of VEDA were studied. α-isobutyl ketone was used as phtoinitiator. Glass transition temperature (Tg) and storage modulus (E') of cured resin were increased after thermal cure. This result is considered to be due to the increase of crosslinking density of the cured resin by condensation reaction of hydroxymethyl group at higher temperature. The cured films of VEDA on glass, steel and poly (methyl methacrylate) plates were found to exhibit good adhesion to those substrates, resulting in introducing hydroxymethyl group.
