Abstract
For the purpose of machining an ultra high frequency quartz resonator, we study making of quartz wafer with uniform thickness by Plasma CVM. In this paper, it was examined that relationship between machining characteristics and elements of equipment (shield of electric field, surface roughness of vacuum chuck, etc.). Machining of quartz wafer was carried out by utilizing the rotary electrode. Then, following results were obtained. First, by setting dummy quartz wafers around the objective sample, the boundary condition of process was stabilized, and vaiation of removal depth on quartz wafer was improved. Second, the linear relationship between dwelling time of plasma and removal depth was obtained, and it was proven that high-precision machining of quartz wafer by the numerically controlled plasma CVM was possible.
