Journal of Smart Processing
Online ISSN : 2187-1337
Print ISSN : 2186-702X
ISSN-L : 2186-702X
New Chip Joint Method for Silicon Die Bonding
Jun MIZUNO, Katsuyuki SAKUMA, Naoko UNAMI, Masatsugu NIMURA, Syuichi SHOJI
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Keywords: Bonding, 3D Integration, Flip Chip, Vacuum Ultraviolet, Formic Acid, Underfill, Flux-less
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2012 Volume 1 Issue 3 Pages 120-125

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© 2012 Smart Processing Society for Materials, Environment & Energy
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