Journal of Smart Processing
Online ISSN : 2187-1337
Print ISSN : 2186-702X
ISSN-L : 2186-702X
Relation Between Metal Filler and Electrical Conductivity for Electrically Conductive Adhesives
Hiroshi NISHIKAWA
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Keywords: Electrically Conductive Adhesive, Metal Filler, Cu Particles, Low-temperature Bonding, Conductivity
JOURNAL FREE ACCESS

2012 Volume 1 Issue 3 Pages 138-142

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© 2012 Smart Processing Society for Materials, Environment & Energy
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