Journal of Smart Processing
Online ISSN : 2187-1337
Print ISSN : 2186-702X
ISSN-L : 2186-702X
The Film-formed Adhesive Material for the Semiconductor Assembly Contributing to the Development of New Products
Isao ICHIKAWA
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Keywords: Pressure Sensitive Adhesive, Die Bonding Film, Backside Coating Film, Dicing Tape, Back Grinding Tape
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2021 Volume 10 Issue 6 Pages 344-350

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