Journal of Smart Processing
Online ISSN : 2187-1337
Print ISSN : 2186-702X
ISSN-L : 2186-702X
Study for Cu-Cu Bonding Technology by Nanoporous Cu Structure
Daiki FURUYAMAJunta INOUETakuma NAKAGAWAKoji TATSUMISho NAKAGAWATakuma KATASE
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2022 Volume 11 Issue 5 Pages 227-232

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Abstract
The objective of this study is to consider candidate materials for Cu-Cu direct bonding as advanced interconnect technology using Nanoporous Cu materials. Nanoporous Cu structure can be obtained by two kinds of electroplating process. One is the direct porous plating process by additive which can form Nanoporous structure directly. The other is de-alloying process which can form Nanoporous structure by de-alloying of Cu-X alloy. By using electroplated Nanoporous Cu structure, we compared the property of Nanoporous structure and carried out the bonding test. Nanoporous structure shows higher bonding strength because of its unique properties. The possibility that Nanoporous Cu is promising materials for advanced bonding technology was confirmed.
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© 2022 Smart Processing Society for Materials, Environment & Energy
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