抄録
Conventional printed circuits have been manufactured by using etching technologies. In recent years, printed electronics has been attracting attention as an alternative method. This technique is performed by a simple process of applying a conductive paste to a solid substrate and sintering. Due to the recent energy situation and in order to use a flexible polymer substrate, sintering at a lower temperature in a shorter time is required. In this paper, copper nanoparticles stabilized with alkylcarboxylic acid, prepared by a liquid-phase reduction process is proposed. The paste of these copper nanoparticles were successfully prepared by using a bead mill. The product films sintered under 3% hydrogen / nitrogen mixed gas showed a good volume resistivity of 5.1×10-6 Ω・cm. Conductivity was also confirmed with the product sintered under nitrogen, but the surface oxidation of copper nanoparticles limited the necking growth of the nanoparticles.
