Abstract
Localized, quick, and non-contact soldering technique has been required for soldering leaded components to printed circuit
board. In order to satisfy these requirements, induction heating （IH） soldering technique was studied. In the case of conventional
iron soldering, many factors affecting heat loss in the heat pass from heat source to component lead exists. On the other hand, in
the case of IH soldering, component lead can be directly heated by IH. Therefore, adopting simulation technique for IH soldering
is reasonable. Using the thruhole - lead model, heating power of IH heating was calculated by magnetic simulation. Joule loss
densities of the IH soldering model were calculated. Skin-depth effect in component lead during IH soldering was confirmed by the
calculation. Temperatures of component lead were also calculated from joule loss density. The calculated temperatures agreed with
observed temperatures of component lead during IH soldering.
