Adhesion Mechanism of Copper Plating Film to Glass Substrate Using SnO₂ by LPD Method

Abstract

We investigated a method of copper plating on glass substrates wit h high smoothness and insulation properties and excellent transmission characteristics, while maintaining the smoothness of the substrate. The tin oxide deposited by the liquid phase deposition method acts as an adhesion layer between the glass substrate and the plating film, which was obtained to copper plating film with excellent adhesion. In this report, we discuss the microstructure of the plating film interface where high adhesion is obtained.