Abstract
It is important for semiconductor components to increase the adhesion strength between the mold resin and lead frames.
Particularly under high-stress environments such as automotive components, high reliability of adhesion becomes more important
compared to conventional methods. We have researched the method of roughened copper plating by using the Periodic Reverse
Pulse （PR pulse） current plating. As a result, we have developed a high surface area ratio （S-ratio） film by using the nitrogen
additives without sulfur additives. This film shows high adhesion, resulting in a shear strength of 27 MPa or more. This technology
is expected to show higher reliability in the field of power devices, such as high current and high temperature conditions.
