抄録
The movement towards carbon neutrality (CN) is accelerating globally. In the manufacturing industry, we are developing energysaving
products and services that lead to the reduction of greenhouse gas (GHG) emissions, as well as promoting the production
of energy-saving products. SiC power semiconductors, which are one of the energy-saving products, use Ag sintered materials that
require high-temperature firing in the die bond part to improve product performance. In order to derive the properties of Ag sintered
materials governed by sintering shrinkage, understanding the behavior of sintering shrinkage and its mechanisms is necessary for
material and process optimization. In addition, to promote energy saving in the manufacturing process, it is also necessary to have
the technology to appropriately design the heat treatment conditions based on the sintering mechanism. In this paper, we introduce
the measurement of the sintering shrinkage behavior that governs the characteristics of Ag sintered bonding, t
