Journal of Smart Processing
Online ISSN : 2187-1337
Print ISSN : 2186-702X
ISSN-L : 2186-702X
Low Stress Packaging for Semiconductor Sensor
Yoshiharu SANAGAWA
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Keywords: Wafer Level Package, Room Temperature Bonding, Surface Activation, Stress Relaxation, MEMS
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2013 Volume 2 Issue 1 Pages 12-16

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© 2013 Smart Processing Society for Materials, Environment & Energy
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