Reliability of Al Wire Bonding for SiC Power Modules Operating at Temperatures Above 200°C

Abstract

  This paper reports the results of a study on the reliability of aluminum wire for use with SiC devices operating at temperatures above 200°C. In recent years, SiC-based power modules operating at such temperatures have been proposed for the purposes of miniaturization. However, this requires the complete reassessment of all packaging components under high-temperature conditions. We evaluated the reliability of aluminum wire during high-temperature exposure at 250°C, thermal-cycle testing between -40 and 250°C, and power-cycle testing with ΔTj=165°C. The results indicated that the wire meets the IEC607439-22 guidelines for pull strength and the industrial reliability requirements for power-cycle tests.