抄録
Recently, power semiconductor packages have been applied to various types of industrial equipment by increasing the energysaving consciousness. The thermal grease used in the attachment part of the heat sink of power semiconductor packages exhibits high thermal resistance. When a solder junction is formed with a Cu-plate structure, cracks might form in the junction. We propose a power semiconductor package structure that uses a Cu tray as heat spreader and potting seal case to reconcile low heat thermal resistance and high reliability. Numerical analysis showed that plastic strain reduced by about 72% by forming fillets around the solder junction. Through temperature cycling tests with these structures soldered on an Al board, the exfoliation of the solder junctions of the proposed structure about 70% decreased compared those of the Cu-plate structure.
