Journal of Smart Processing
Online ISSN : 2187-1337
Print ISSN : 2186-702X
ISSN-L : 2186-702X
About Present Condition and Outlook of Packaging Technology for a Power Semiconductor Module
Yoshinari IKEDA, Yoshitaka NISHIMURA, Eiji MOCHIZUKI, Yoshikazu TAKAHASHI
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Keywords: Power Semiconductor Module, Packaging Technology, IGBT, MOSFET, Si, SiC
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2015 Volume 4 Issue 1 Pages 46-50

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© 2015 Smart Processing Society for Materials, Environment & Energy
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