2015 年 4 巻 2 号 p. 83-88
Application of displacement-load control to vacuum free self-induced fusion solidification bonding of aluminum with copper insert metal was investigated in this study. Vacuum free bonding requires the fracture of the oxide film and the contact of the clean surfaces, because the oxide film on the bonding interface acts as the anti-bonding factor. The displacement-load control method by set bonding load controlled maximum contact pressure in the cyclic deformation between the solid bonding surfaces. Cyclic contact of the solid surfaces occurred the fracture of the oxide film which formed on the surface. The displacement-load control promoted vacuum free bonding than the static load method by the weight. Bonding area ratio increased with the increase of bonding time and insert metal thickness. Set bonding pressure also increased the bonding area ratio. Evaluation for the effect of the set bonding pressure on the change of bonding area ratio suggests that the effective minimum bonding pressure which occurs the fracture of the oxide film will be exists.