パワーモジュール向け高信頼Sn-Cu 系はんだの開発
2015 年 4 巻 4 号 p. 184-189
詳細
2015 年 4 巻 4 号 p. 184-189
Demands of the raising operation temperature of power modules have been increasing in recent years. However, the power cycle capability is insufficient when used in a high temperature environment to apply the conventional Sn-based solder. In this study, we have developed a highly reliable bonding technology that improves the characteristics of the Sn phase by adding additional elements Bi, In, Sb to the Sn-7Cu solder. Power cycling test (Tjmax 175°C) was carried out to evaluate the reliability. Power cycling reliability of Sn7Cu3Bi, Sn7Cu10Sb is approximately 3 times, 6 times higher than Sn7Cu.
