Journal of Smart Processing
Online ISSN : 2187-1337
Print ISSN : 2186-702X
ISSN-L : 2186-702X
A Study of Solder Ball Joint Reliability of Electroless Ni/Pd/Au Plating － Influence of Electroless Pd Plating Film Thickness－
Yoshinori EJIRI, Takaaki NOUDOU, Akio TAKAHASHI, Takehisa SAKURAI, Yoshinori ARAYAMA, Yoshiaki TSUBOMATSU, Kiyoshi HASEGAWA
Author information
Keywords: Electroless Ni/Pd/Au, Solder Ball Joint Reliability, Reflow Cycle, Thermal Aging, IMCs (Inter-Metallic Compounds)
JOURNAL FREE ACCESS

2016 Volume 5 Issue 4 Pages 221-228

Details
Download PDF (1569K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
We investigated the influences of Pd film thickness of electroless Ni/Pd/Au plating on the solder ball joint reliability during reflow cycles and thermal aging, using high-speed solder ball shear test. As the solder ball, Sn-3.0Ag-0.5Cu solder ball was studied. After multiple reflow cycles and thermal aging, we found that the optimum thickness of Pd film with Sn-3.0Ag-0.5Cu solder ball was 0.05-0.2 μm.
Content from these authors
© 2016 Smart Processing Society for Materials, Environment & Energy
Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top