抄録
We have developed a new wafer stacking technology with solder-base through silicon vias fabricated by ViaS (vertical integration after stacking) process. The technology will provide a low cost solution of 3D integration which can fit to high volume and cost sensitive products such as IoT applications. The structure consists of organic insulator by vapor deposition polymerization and solder as conductor formed by molten solder filling technique. In this paper, we report the process flow, key technologies, a demonstration result, mechanical modeling, and analysis results of the interface interaction between the polymer insulator and the solder via metal.
