Experimental Investigation on Natural Air Cooling of IC Boards

Abstract

An experimental investigation is made on natural air cooling of five vertical parallel IC boards with equal interval and the same sizes (285 ^hx237 ^w mm ²) of each board, where gap between the boards ranges 9.8 to 34.8mm and heat generated per each board from 3.5 to 16.0W. The temperature fields among boards are visualized be Mach-Zehnder Interferometer in the three different regions to show the effects of packages, gaps and heat fluxes. The surface temperatures of packages and boards are also measured by copper-constantan thermocouples. Discussions are made by comparing the local Nusselt numbers obtained with the previous correlation.