Abstract
IC boards are widely used to operate and control the electronic components. The Semiconductor, resistor, condenser and so on are installed on the surface of bare board plates of the P.C.B.. Generated heat of those elements on the board is transferred to the air coolant flowing through the vertical parallel channel. Heat removal performance is so complicated by flow pattern of the coolant and heat generation rate of the electronic component.
The heat transfer rate of the mounted board is enhanced by the tunnel effect with the gap between the vertical parallel plates as a parameter. This paper represents to determine the optimum width of the vertical channel in respect of the heat removal performance. The infrared radiometer was used to measure the isotherm pattern of the IC board through the transparent polypropylane plate. The heat transfer characteristic was measured and analyzed using the visualized isotherm pattern displayed on the CRT of the infrared radiometer.
