Abstract
This paper presents the results of experimental and numerical studies on the effect of casing inclination on the temperature rise across the casing. The numerical simulation was carried out to find the thermal behavior inside a thin electronic casing. The simulation results are in good agreement with the experimental data. From the results, it was found that the natural air cooling capacity was improved by increasing the inclination angle of the casing. In addition, comparison between the visualization results of PIV and a numerical simulation results was carried out.
