Abstract
For stable semiconductor device manufacturing, the management of the smaller size of particles must be required since the latest device is getting highly integrated with pattern dimension shrinkage year by year.
Most of particles attached on the wafers will be generated under the processing at the process equipment.
To maintain the high-yield of the semiconductor devices, particle number/size of all process equipment should be monitored. And it will be important to determine the root cause of the particle generation and the measure as soon as possible if particle number over the control limit is detected.
On this article, the latest techniques about particle detection on the wafers, efficient observation/review, and particle element analysis are introduced.
