Abstract
The Aerosol Deposition Method is a film coating technology where the impact of solid state particles can create a strongly adherent, high-density nano-crystalline ceramic film by gas blasting the submicron-sized ceramic particles on to a surface. The deposition rate is 30∼100 times faster than obtained with conventional thin film technology and the ceramic thin film can be deposited at room temperature. It is expected to reduce energy, cost, difficulty to fabricate the thin or thick film with complicate material compositions and the number of processes during fabricating electronic devices and others, as well as to improve their performances substantially. This technique is particularly useful for fabricating inorganic thick films and producing energy devices. This chapter deals with the mechanism and feature of the AD process first, followed by its application for energy related devices.
