Abstract
We investigate flaked particles instantaneously generated in mass-production plasma etching equipment. Particles flaking off from films deposited on the ground electrode are detected by using laser light scattering system. Not only the number of particles but also the size of them obviously increases when micro-arc discharge occurs around a wafer and floating potential (inner wall potential) changes instantaneously. The results of this study provide evidence that electric field stress acts as impulsive force due to rapidly changing floating potential, causing dramatically breaking of deposited film and many large particles.
