Abstract book of Annual Meeting of the Japan Society of Vacuum and Surface Science
Online ISSN : 2434-8589
Annual Meeting of the Japan Society of Vacuum and Surface Science 2019
Session ID : 2P38
Conference information

Plasma potential control with dual cathode high power pulsed magnetron sputtering apparatus
*Naohiko MaedaNana FujiiTokeo Nakano
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract

We have reported a high power pulsed magnetron sputtering (HPPMS) system which equipped the third electrode to control the plasma potential positively. It enabled the acceleration of the generated ions within the plasma the to grounded substrate, by which the metal films with a flat surface and dense structure could be obtained. However, the third electrode had to accept the large current, and the cooling of it was considered to be favorable for the stable operation. In this study, we developed the dual cathode HPPMS apparatus. We applied the pulse powers to these cathodes with half-cycle differences, and the cathode voltage during the rest of the period was kept positive. By this, we expect the positive plasma potential throughout the period and the proper cooling of both electrodes (cathodes). In the presentation, the fundamental discharge properties will be reported.

Content from these authors
© 2019 The Japan Society of Vacuum and Surface Science
Previous article Next article
feedback
Top