Development of reciprocal-space-map evaluation method for three-dimensional Si structure surface with construction of multi-axes controlled RHEED system

Abstract

To improve the performance of three-dimensional MEMS devices, it is important to control the sidewall surface and facet surface of the three-dimensional structure, which are the boundary region with the external world and carrier transport region, with atomic precision. We have developed a multi-axis RHEED system to generate three-dimensional inverse spatial maps from multiple RHEED patterns with different electron beam incident azimuth angles (φ). Now, we have successfully measured the faceted surface of 3D-Si sample by improving the measurement equipment and software. In this talk, we will report the details.