Preprints of the National Meeting of JWS
the national meeting 2005 autumn
Session ID : 129
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Host: japan welding society

Interfacial reaction and joint strength for Sn-Ag-Co solder/Cu
*Akira Komatsu, Hiroshi Nishikawa, Feng Gao, Tadashi Takemoto
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Keywords: Pb-free solder, Co addition, Intermetallic compound, Joint strength
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[in Japanese]
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© 2005 by Japan Welding Society
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