Preprints of the National Meeting of JWS
the national meeting 2005 autumn
Session ID : 132
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Host: japan welding society

Study on The Interface Characteristics of Copper Direct Bonding Using Thin Film of Sn-In
*Katsumi Taniguchi, Tomoaki Goto, Kouzo Fujimoto, Kiyokazu Yasuda, Fukutarou Nishizawa
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Keywords: Direct bonding, Reaction diffusion, Dissolution, Copper, Low melting temperature alloys
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Abstract
We have investigated the direct bonding process low melting point Sn-In alloy. Because the Sn-In diffuses to Cu bulk completely, it is assumed that joint was strengthened highly. It is found that adding Sn content into the insert alloy, 70%-Sn was highest shear strength 100MPa.
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© 2005 by Japan Welding Society
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