In-situ Observation of Ultrasonic Wire-Bonding Process

Abstract

Correct understanding on the adhesion mechanism in ultrasonic wire-bonding is required for optimum design and control of the bonding process. The present study aims to resolve the deformation behavior of the wire during ultrasonic bonding by in-situ observation and measurement using high-speed video camera and position sensor. Based on the results, the adhesion mechanism is discussed.